Event Calendar

Thursday, June 20, 2024

iNEMI Presentation at iMAPS France MiNaPAD Forum

Start Date: 6/20/2024 2:15 PM CET
End Date: 6/20/2024 2:45 PM CET

Venue Name: World Trade Centre Grenoble

Location:
5-7 place Robert Schuman
Grenoble, France  38025

11th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD) Forum

June 20, 2024 
Session O: Reliability 2
14:15-14:45 CEST (Europe)
Room: Mont Blanc



Sze Pei Lim (Indium Corporation) will present “The Effects of Voids on Solder Joint Reliability in First Level Interconnect” at the 11th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD) Forum. Her presentation is based on information from iNEMI’s 1st  Level Interconnect Void Characterization Project and will explore the effects of voids on solder joint reliability in first-level interconnect (FLI) by examining the results of three different reliability tests. With the emergence of advanced packaging technology and heterogeneous integration, micro Cu-pillar bump is widely used as FLI. Micro voids are often found in this kind of FLI flip-chip attach and there are limited insights on the effects of voids on the reliability of the flip-chip solder joint.
 
If you’re planning to attend the forum, be sure to check out this session.