Event Calendar

Start Date: 9/24/2024 10:00 AM JST
End Date: 9/24/2024 11:00 AM JST

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Organization Name: iNEMI

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Abstract
 
High-temperature interconnections are in demand due to advances in high-power device development, integration, miniaturization, and high-power density applications in various electronic devices. Tin-copper (Sn-Cu) is one of the most widely used lead-free (Pb-free) Sn-based alloy systems for low and medium temperature interconnection systems due to its low cost, good fluidity, and low incidence of hot cracking and segregation. Using a promising processing technique known as transient liquid phase (TLP) bonding, it is possible to achieve a reliable high-temperature interconnection. This webinar will provide an overview of TLP bonding for high-temperature soldering processes achieved at the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), a collaboration between the University of Queensland and Nihon Superior Co. All data shown in the seminar has been published in peer-reviewed journals or presented at international conferences by NS CMEM.
 
 
About the Speaker
Professor Nogita graduated as an engineer in Japan in 1990 and worked in the nuclear power industry with Hitachi Ltd. He was awarded a Ph.D. from Kyushu University in 1997. He migrated to Australia in 1999 after accepting a position at the University of Queensland, where he became the founding director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) in 2012 as well as project manager of the University of Queensland – Kyushu University Oceania project (UQ-KU project) and Deputy Chair of the International Development and Engagement Committee at the School of Mechanical and Mining Engineering. He is also an invited Professor at Kyushu University and a Research Adviser at the University of Malaysia Perlis.
 
Dr. Nogita’s research is in three major areas: Pb-free solders and interconnect materials, energy materials such as hydrogen-storage alloys, and structural and coating alloy development. He holds 19 international patents and has authored over 250 refereed scientific papers with an h-index of 57 (Google Scholar Aug 2024). He is a deputy chair for the Electronic Packaging and Interconnection Materials (EPIM) Committee (since 2022), and leading organizer (2019 and 2023) and co-organizer of the “Emerging interconnect and Pb-free materials for advanced packaging technology” symposium at TMS in the USA (2015 to present). He was the recipient of the TMS Research to Industrial Practice Award in 2021.
 
Registration
This webinar is open to industry; advance registration is required (see link below). If you have an questions or need additional information, please contact Mashiro Tsuriya (m.tsuriya@inemi.org).
 
September 24, 2024
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on September 23
Register for this webinar
 
Also see Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders (September 17)