Event Calendar

Start Date: 10/17/2024 10:30 AM HKT
End Date: 10/17/2024 12:10 PM HKT

Location:

Organization Name: iNEMI

Contact:

40th International Electronics Manufacturing Technology Conference
October 16-18, 2024
Penang, Malaysia

 iNEMI is hosting a session at the IEMT conference that will feature presentations from several iNEMI projects. We hope to see you there! Check back for information about date and time for this session.

Haley Fu (haley.fu@inemi.org) will be attending the conference. Send her an email if you'd like to meet at IEMT.
 
 

Session D1: iNEMI Special Track / Packaging Trend
Thursday, October 17, 2024 / 10:30 a.m. — 12:10 p.m.
Session Chair: Ooi Chun Keang (Intel)

“Fine pitch 2.5D & 3D Advance Packaging Assembly Using Thermal Compression Bonding for Chiplet Integration”
Presenter:  Samuel Goh (Kulicke & Soffa)
 
“Enhancing AOI with AI for Printed Circuit Board Assembly – A Comprehensive Industry Study”  
Presenter: Feng Xue (IBM)
iNEMI project: AI Enhancement to AOI for PCBA

“High Density Interconnect (HDI) Socket Dynamic Warpage Prediction via Mori-Tanaka Model”
Presenter: Ooi Chun Keang (Intel)
iNEMI project: High Density Interconnect Socket Warpage Prediction and Characterization
 
“Recent iNEMI Research on Electromigration in Tin-Bismuth Solder
Presenter: Prabjit Singh (IBM) and Haley Fu (iNEMI)
(PJ’s presentation will be pre-recorded and Haley will be onsite)
iNEMI project: Electromigration of SiBn Solder for Second-Level Interconnect