Event Calendar

Start Date: 12/6/2024 8:00 AM HKT
End Date: 12/6/2024 9:00 AM HKT

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Organization Name: iNEMI

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High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases. With large sockets, dynamic warpage prediction and control during reflow onto the printed circuit board is a significant challenge. Simulation is critical in the product development process, helping designers make the right design choices before significant investment in tooling and industrialization. Socket warpage prediction is now facing a few challenges. The majority of simulation computation is consumed by flow analysis in the pin hole region. An ability to speed up computation is desired to shorten socket design cycle. At the same time, accuracy of the simulation needs to be retained at an acceptable level.

 

Phase 1 of the High Density Interconnect Socket Warpage Prediction and Characterization Project investigated the impact of socket design, fiber-filled material properties and molding process conditions on socket warpage. Results showed computational time could be reduced for the flow part of simulation with reasonable accuracy.

 

Phase 2 of the project continued the work of improving socket warpage simulation accuracy and further investigated the impact of molding materials and design on warpage for large sockets. The liquid crystal polymer (LCP) material used in socket manufacturing exhibited anisotropic behavior due to a mixture of an inherently anisotropic polymer matrix with anisotropic fillers (compared to general plastics). The team found that standard composite model assumptions for socket warpage may under- or over-predict warpage. This was because the standard composite model adopted a polymer matrix assuming the material was homogeneous, but it did not consider the effect of fillers. Thus, the project team investigated a new Mori-Tanaka mechanics model as it has the capabilities to incorporate both the polymer matrix and the anisotropic effect of fillers.

 

This end-of-project webinar will report the results and lessons learned from Phase 2 of the High Density Interconnect Socket Warpage Prediction and Characterization Project.

 

Registration

Two sessions are scheduled (with the same content) and are open to the public; advance registration is required. If you have any questions or need any additional information, please contact Haley Fu (haley.fu@inemi.org).

 

Session 2 

Friday, December 6, 2024
8:00-9:00 a.m. CST (China)
7:00-8:00 p.m. EST (US) on December 5

Register for this webinar

Session 1
Thursday, December 5, 2024
7:30-8:30 a.m. EST (US)
1:30-2:30 p.m. CET (Europe)
8:30-9:30 p.m. CST (China)
Register for this webinar