Event Calendar

Tuesday, March 14, 2023

iNEMI / MAESTRO Session at iMAPS Device Packaging Conference

Start Date: 3/14/2023 10:45 AM MST
End Date: 3/14/2023 12:45 PM MST

AZ  United States 

Organization Name: iNEMI

Urmi Ray
Email: urmi.ray@inemi.org
Phone: (984) 333-0820

iMAPS 19th International Conference & Exhibition on
Device Packaging

March 13-26, 2023 / Fountain Hills, Arizona USA


Next Gen Applications Track / TA3: iNEMI Invited Session
5G/6G Roadmap Creation and Packaging Challenges

Chair: Urmi Ray (iNEMI)
Tuesday, March 14, 2023
10:45 a.m. — 12:45 p.m.
This session will summarize a NIST Office of Advanced Manufacturing supported roadmap effort — 5G/6g mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). The goal of this roadmap is to create in the U.S., a world-leading knowledge base, technical expertise and a staged approach to mmWave material selection, characterization, and test– the first necessary foundation for leading edge 5G and 6G products. Higher levels of performance directly translate, through lower losses and higher linearity, into better range, coverage, and penetration for next-generation U.S. wireless networks, reaching more of the U.S. population and businesses more quickly and economically. 

This workshop comprises four presentations outlining the status of the benchmarking phase as shown in the paper titles below.
Topic Speaker
Status Update
5G/6G MAESTRO Roadmap
Urmi Ray, iNEMI
Benchmarking 6G Hardware
System Design Needs
Prof Markondeyaraj Pulugurtha and Satheesh Bojja Venkatakrishnan, 
Florida International University
5G/6G MAESTRO Materials: Glass Substrates for mmWave/sub-THz Applications Paul Ballentine and Shelby Nelson, Mosaic Microsystems
5G Electronics: Bridging the Measurement Challenges Lucas Enright, NIST


5G/6G MAESTRO Roadmap
The iNEMI team has been entrusted with developing a comprehensive NIST Advanced Manufacturing Technology (MfgTech) Roadmap on the topic of 5G/6G mmWave Materials and Electrical Test Technology (5G/6G MAESTRO). The goal of this technology roadmap is to create in the U.S. a world-leading knowledge base and technical know-how in mmWave material selection, characterization and test – the first necessary foundation for the development and manufacturing of leading edge 5G and 6G products with the highest radio performance. This paper will provide an introduction to the roadmap creation, and provide a status, including highlights of the progress to date.
Benchmarking 6G Hardware System Design Needs
This presentation will discuss key advances in system architectures and package integration that will enable future mmWave systems. Beamforming architectures as the key design building block for high-gain massive MIMO communications will be reviewed in the first part. Various architectures will be classified to compare their advantages and disadvantages. The reduction in system complexity and overall power consumption through hardware simplification with digital beamforming will be discussed. Passive integration to lower interconnect parasitics is the next critical block for functions such as filters, beamsplitters or power dividers, interference cancellation and others. The use of various Intelligent Reactive Surfaces (IRS) to further improve spectral efficiency will be discussed in this section. Antenna integration in packages will active-passive integration of transceiver ICs, passives and beamforming will be discussed in the following subsections. The last part discusses various mmWave imaging approaches as a key future application for 5G technologies.

5G/6G MAESTRO Materials: Glass Substrates for mmWave/sub-THz Applications
This paper will explore the use of glass substrates for wireless components at frequencies ranging from 30 GHz - 240 GHz.  Applications include both communications and radar/sensing.  Examples of devices that can benefit from glass substrates include individual passive devices, filters, diplexers, and antenna arrays.  We will discuss the properties of glass and how they translate into improved performance with lower power and size

Developing Standards for Industrial measurements of Low-loss Dielectrics
Industry relies on traceable standards to ensure individual laboratories agree on the true value of measured quantities. From gauge blocks for mechanical dimensions to ultra-pure chemical samples for biological applications, traceable reference materials provide internationally agreed upon, known value artifacts that are essential for calibrations, acceptance testing, and internal assessments. Today, no such standard exists for dielectric constant and loss tangent. As a result, a material producer and a material consumer may disagree on the measured dielectric constant of a given sample and have no recourse to know who is correct. This problem has led the International Electronics Manufacturing Initiative (iNEMI) to coordinate 26 stakeholders to develop an effort to develop best practices and requirements for new standards for industrial measurements of low-loss dielectrics [1 - 3]. Here, we show the development of the next standard for dielectric constant and the results of round-robin experiments on prototype standards from 10 GHz – 110 GHz. These results show that for a typical industry sample even the best industrial and government labs may disagree within 4%, but for prototype standards that disagreement shrinks by almost an order of magnitude. With a known dielectric constant, these standards will improve industrial measurement accuracy and enable reliable measurements of existing and new low-loss dielectrics.

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