Event Calendar

Tuesday, March 28, 2023

iNEMI Packaging Tech Topic Series: Evolution of Power Packaging

Start Date: 3/28/2023 9:00 AM EDT
End Date: 3/28/2023 10:00 AM EDT

United States 

Organization Name: iNEMI

Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

Evolution of Power Packaging: Assembly and Thermal Interface Materials
Presented by Andy Mackie, PhD, Indium Corporation
Tuesday, March 28, 2023
9:00-10:00 a.m. EDT (US)
3:00-4:00 p.m. CEST (Europe)
22:00-23:00 p.m. JST (Japan) 
Register for this webinar 

This presentation will provide an overview of the evolution of power electronics packaging, with a focus on advancements in assembly and thermal interface materials. Power electronics have become increasingly important in modern electronic systems, and as a result, the packaging technology has also evolved significantly in recent years.
The webinar will cover:

  • Challenges associated with power electronics packaging and the critical role that assembly and thermal interface materials play in addressing these challenges
  • Impact of emerging technologies such as silicon carbide (SiC) and gallium nitride (GaN) on power electronics packaging and the new challenges they pose
  • An in-depth analysis of the different types of materials used in power electronics packaging, their advantages, and limitations
  • The future direction of power electronics packaging and the potential for further advancements in assembly and thermal interface materials to enable even more efficient and reliable power electronic systems
About the Speaker
Andy Mackie, PhD, MSc
Thermal Interface Materials Applications
Indium Corporation
Dr. Mackie is an electronics industry expert with a technical background in semiconductor fabrication and packaging materials and processes. Andy’s professional experience covers all aspects of electronics manufacturing, from wafer fabrication to semiconductor packaging and
SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet emerging thermal interface material requirements.
Dr. Mackie has been an invited International keynote speaker and has lectured internationally. He holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK. He is an alumnus of the UC Berkeley Product Management program (2015) and the RIT Kate Gleason College of Engineering Short Course in IC Processing (2003).
Current industry associations:
  • iMAPS Fellow
  • Member of the iNEMI Board of Directors
  • IEEC Technical Advisory Board
  • Advisory Board of Automotive Electronics Council (AEC)
  • Committee member of Power Semiconductor Manufacturers Association (PSMA) Packaging Group
  • Past Chair of two IPC Task Groups: Sintering Materials (founder), and Solder Paste
  • IEEE Heterogeneous Integration Roadmap: Thermal TWG and Wideband Gap TWG
  • Member of IEEE: PELS, PES, TEMS, Photonics Societie