Advancing Manufacturing Technology

Event Calendar

Thursday, March 11, 2021

5G/mmWave Technical Sharing Series - Packaging for mmWave Communications

Start Date: 3/11/2021 11:00 AM EST
End Date: 3/11/2021 12:00 PM EST

United States 

Organization Name: iNEMI

Grace O'Malley
Phone: (984) 333-0820

Packaging for mmWave Communications
Presenter: Prof. Madhavan Swaminathan, Georgia Institute of Technology
Thursday March 11, 2021 
11: 00 a.m. — 12:00 p.m. EST (Americas)
5:00-6:00 p.m. CET (Europe)
Register now

The current buzz in the semiconductor industry is heterogeneous integration. As the industry moves forward with several applications being data driven, there is a clear trend toward the convergence of computing, communications, sensing and control technologies. Packaging can play a significant role in enabling the convergence of these technologies.

On the communication side emerging 5G mmWave frequencies are projected to support enormous bandwidth with 1-10Gps data speeds. Active research is ongoing to increase the data speeds even more by moving to higher frequencies in the sub-THz frequency range namely, 6G. With a broad range of frequencies to support, advanced packaging solutions are required. 

This presentation addresses the needs for 5G and 6G communication along with a review of the state of the art for package level integration. The progress made on glass interposer-based solutions at Georgia Tech’s Packaging Research Center will be discussed along with future needs as we progress towards sub-THz frequencies.

About the Presenter
Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT). He also serves as the Site Director for the NSF Center for Advanced Electronics through Machine Learning (CAEML) and Theme Leader for Heterogeneous Integration, at the SRC JUMP ASCENT Center. He formerly held the positions of Founding Director, Center for Co-Design of Chip, Package, System (C3PS), Joseph M. Pettit Professor in Electronics in ECE, and Deputy Director of the Packaging Research Center (NSF ERC), GT. Prior to joining GT, he was with IBM working on packaging for supercomputers. 

Dr. Swaminathan is the author of 500+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of three books and five book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. 

He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.

Upcoming Webinars in the 5G/mmWave Technical Sharing Series

Broadband Dielectric Characterization of Polymers and Glass (April 8)

Standard Reference Materials for 5G and Microwave Materials at NIST (May 6)