Event Calendar

Thursday, April 18, 2024

iNEMI Session at ICEP 2024

Start Date: 4/18/2024 9:45 AM JST
End Date: 4/18/2024 10:30 AM JST

Location:
Toyama, Japan 

Organization Name: iNEMI

Contact:
Haley Fu
Email: haley.fu@inemi.org
Phone: (984) 333-0820

2024 International Conference on Electronics Packaging (ICEP)
April 17-20, 2024
Toyama, Japan

If you plan to be at ICEP this year, be sure to join us for the iNEMI session. 
 

TA1: iNEMI Session
Thursday, April 18, 2024
9:40-11:20 a.m.

 
TA1-1 Electromigation in Eutectic Tin-Bismuth Alloys With Third Component Metallic Elements
Presenter: Prabjit Singh, IBM
iNEMI project: Electromigration of SnBi Solder for Second-Level Interconnect
 
TA1-2 Adhesion Characterization of Redistribution Layer
Kor Oon Lee, Intel / Malaysia
iNEMI project: RDL Adhesion Strength Measurement
 
TA1-3 High Temperature Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
Ian Chin, Intel Microelectronics 
iNEMI project: Moisture Induced Expansion Metrology for Packaging Polymetric Materials, Phase 1
 
TA1-4 Low Temperature Material Discovery and Readiness for 1st Level Interconnect in Semiconductor Packaging
Presenter: Sze Pei Lim, Indium / Malaysia
iNEMI project: Low Temperature Material Discovery and Characterization for First Level Interconnect
 


iNEMI Member Meeting & Luncheon
Thursday, April 18 / 1:00 p.m.
ANA Crowne Plaza Toyama (near the conference venue)

iNEMI will hold a members meeting and luncheon during the ICEP 2024 conference in Toyama City. This is an opportunity to meet and network with other iNEMI members and to learn about iNEMI’s latest initiatives. We’ll also have a guest speaker who will share information about the latest packaging trends. For information, please contact M. Tsuriya (m.tsuriya@inemi.org).