Event Calendar

Start Date: 4/6/2024 8:00 AM PDT
End Date: 4/11/2024 5:00 PM PDT

Venue Name: Anaheim Convention Center

IPC APEX EXPO / Electronic Circuits
World Convention (ECWC16)
April 6-11, 2024 / Anaheim, California USA
 

iNEMI Session 1: Bridging the Gap — Ultra HDI Challenges

iNEMI Session 2: iNEMI Roadmap Workshop — Future Evolution

iNEMI Session 3: mmWave Material and Test Roadmap and Standard Development

Taiwan High-Tech Forum

Technical Conference Paper

Tuesday, April 9

iNEMI Session 1
Bridging the Gap: Ultra HDI Challenges 
9.45 a.m. -- 12:15 p.m.
Location: 303C
Event Type: Special Event

Description
Mainstream PCB technology is moving inexorably toward packaging substrate scaling and performance; however, there are considerable process and material challenges in addition to developing new standards with associated inspection and quality controls.

This iNEMI workshop will leverage the technology roadmaps for PCB and packaging and, through a high-level approach, highlight the need for a detailed gap analysis. The workshop will discuss the benefit of pre-competitive collaborative efforts to fill the gaps by key stakeholders in the supply chain.

Draft Agenda
Moderator: Tony Senese, Panasonic

iNEMI Session 2
iNEMI Roadmap Workshop: Future Evolution
of PCB Design-for-X
1:30-4:00 p.m.
Location: 303C
Event Type: Special Event


Speakers

• Francis Mullany, iNEMI Director of Roadmapping
• Tarja Rapala, Technology Director, EIPC
• Jasbir Bath, Bath Consultancy
  
• Special guest speaker: Dale Lee, Plexus Corporation, talking about the evolution of design-for-X in the context of PCBs and PCB board assembly.  

    
Description 
PCB design for new product introduction is no longer an activity that is neatly isolated from other system attributes.  Design now needs to look beyond achieving the desired core functionality, it must also model interactions with: 
•    Complex system architectures
•    Manufacturing capabilities and infrastructure
•    Subsequent board and system assembly
•    Sustainability issues

Design and modelling tools increasingly need to be multi-physics, multi-scale and across the full product lifecycle.

This session is an opportunity to learn and shape the future of design and simulation for PCBs, by leveraging and expanding the iNEMI Roadmap.  We will review existing content and insights from the iNEMI Roadmap on topics such as PCBs, Board Assembly, Sustainability and Complex Integrated Systems.

Guest speaker Dale Lee, Plexus Corporation, will talk about the evolution of design-for-X in the context of PCBs and PCB board assembly.  

The second half of the session will be a mixture of brainstorming and discussion to further evolve the iNEMI Roadmap with the combined expertise of APEX attendees. 


Wednesday, April 10
 

Taiwan High-Tech Forum
9:20 a.m. – 4:30 p.m.
Room 304CD

iNEMI is a co-organizer of this event sponsored by Taiwan Printed Circuit Association (TPCA) to showcase the comprehensive strength of Taiwan's electronic industry chain. Two sessions are scheduled: Advanced IC Packaging and Substrate Tech and High-Tech PCB x Sustainability. Get additional details



iNEMI Session 3
mmWave Material and Test Roadmap and Standard Development
9:30-11:30 a.m.
Location: 209B
Event Type: Special Event

Description
This session will summarize the key findings from the NIST Office of Advanced Manufacturing-supported roadmap effort, 5G/6G MAESTRO. The opening paper will provide the overview and goals of the roadmap development effort. The two roadmap chapters: (1) Dielectric Materials Characterization and (2) Materials and Electrical Test Development will be discussed by the roadmap chapter leads. In addition, recent results on standard reference material development for permittivity measurements will be presented.

Speakers & Topics

• Moderator: Urmi Ray (iNEMI)
   
• 5G/6G MAESTRO Roadmap: Overview and Objectives
  Shekhar Chandrasekhar, iNEMI 
   
• 5G/6G MAESTRO: Dielectric Materials Characterization
  Marzena Olszewska-Placha, QWED
   
• 5G Electronics: Bridging the Measurement Challenges with Standards Development
  Lucas Enright, NIST 
   
• 5G/6G MAESTRO: Advanced Packaging
  Urmi Ray, iNEMI

Technical Conference
S23: Assembly Processes 3
3:30-5:00 p.m. / Location: 303A

This session includes the following iNEMI Roadmap presentation:    
iNEMI 2023 Board Assembly-CPU Socket Interposer Technology Roadmap
Paul Wang, PhD, MBA, Tyan Computer (a MiTAC company)