Event Calendar

Wednesday, May 13, 2020

PCB Warpage Characterization and Minimization End-of-Project Webinar

Start Date: 5/13/2020 11:00 AM EDT
End Date: 5/13/2020 12:00 PM EDT


Organization Name: iNEMI

Haley Fu
Email: haley.fu@inemi.org
Phone: (984) 333-0820

Session 1 (The Americas and EMEA)
Wednesday, May 13
11:00 a.m.-12:00 p.m. EDT (US)
5:00-6:00 p.m. CEST (Europe)
Register for webinar
Session 2 (APAC and the Americas) 
Thursday, May 14
9:00-10:00 a.m. CST (China)
6:00-7:00 p.m. PDT (US) on Wednesday, May 13
Register for webinar
The use of thinner components and thinner multi-up panel PCBs (≤ 40 mils) has led to PCB warpage issues in SMT assembly process, which in turn impacts the PCB assembly yield. Study needs to be done in order to gain a better understanding on the key PCB manufacturing factors that impact PCB warpage. This project conducted experiment with a 10-layer PCB test vehicle design using two different PCB suppliers. The experimental factors included PCB post processing (bake & no bake PCB), panel locations (corner & center), PCB thicknesses (0.8 mm & 0.6 mm), Material (Mid Tg & High Tg), and PCB processing (lamination process at PCB vendor A vs. B). The PCB warpage was evaluated using high temperature measurement warpage metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. Data analysis results and findings will be reported at the webinar.
More background information about this project can be found at https://community.inemi.org/pcb_warpage_char