Event Calendar

Tuesday, June 20, 2023

Packaging Tech Topic Series: Challenges in Current Industry Approach to Lithography in Advanced Packaging

Start Date: 6/20/2023 9:00 AM EDT
End Date: 6/20/2023 10:00 AM EDT

United States 

Organization Name: iNEMI

Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

June 20, 2023
9:00-10:00 a.m. EDT (US)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Register now
The current industry approach to lithography for high-performance computing products using 2.5D and 3D advanced packaging schemes limits scaling. Challenges include substrate warpage management, die placement errors, large body size and gaps in metrology. This presentation will talk about new lithography techniques that address these challenges.
About the Speaker
Dr. Jorge Fernandez
Applied Materials   

Dr. Jorge P. Fernandez leads the technical marketing activities in product development for Applied Materials. He brings 24 years of semiconductor experience specializing in electron optics, photon optics, patterned wafer metrology and inspection. Jorge earned his Ph.D. in High Energy Physics from the University of California, Santa Cruz, and has over 30 years’ experience in analytic instrumentation.

For additional information, contact Masahiro Tsuriya (m.tsuriya@inemi.org).