Event Calendar

Tuesday, June 28, 2022

Task Force Report on Low Temperature Material for 1st Level Interconnect - Session 1 (APAC)

Start Date: 6/28/2022 10:00 AM JST
End Date: 6/28/2022 11:00 AM JST


Organization Name: iNEMI

Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

Task Force Report on Low Temperature Material for 1st Level Interconnect
Session 1 (APAC)
Tuesday, June 28, 2022
10:00-11:00 a.m. JST (Japan) 
9:00-10:00 p.m. EDT (Americas) on Monday, June 27
Register for this webinar
Session 2 (Americas & EMEA)
Tuesday, June 28, 2022 
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar
The objective of iNEMI’s Low Temperature Materials for 1st Level Interconnect project is to determine the extent to which the use of lower temperature processes can provide solutions to the challenges of the accelerating trend toward heterogeneous integration.  Most of the elements of these packages have limits on temperature/time exposure, which makes materials that can effect reliable connections at temperatures lower than those required by conventional materials worth consideration.
A task force reviewed material and process options currently available or under development on the basis of their compatibility with the interfaces that have to be connected and the operating conditions to which they are likely to be exposed in integrated circuit packages. The conclusions of these investigations will be summarized in a white paper, which will be the main output of this project.  
Join us for this webinar in which we will report the results of our findings about the prospects for the adoption of low temperature materials for 1st level interconnect.
This webinar is open to industry; advance registration is required. Two webinars (with the same content) are scheduled — please join whichever one which fits your schedule (see links above). For additional information, please contact M. Tsuriya (m.tsuriya@inemi.org).