Start Date: 7/22/2021 8:30 AM CDT
End Date: 7/22/2021 9:30 AM CDT
Venue Name: Webinar
Speaker: John Swanson, MacDermid Alpha
Thursday, July 22, 2021
8:30-9:30 a.m. CST (China)
8:30-9:30 p.m. EDT (Americas) on July 21
The advanced printed circuit board, and related chip substrate, serve as the foundation for design and construction of almost all modern electronic devices. The convenience, speed and processing power of today’s devices depend on smart design decisions, along with material and process choices properly suited to the electronic assembly as well as the end use applications. Recent technology advances call for higher operating frequencies, faster data transmission and every-increasing circuit density.
When considering circuit board and substrate finishes, the above-cited technology developments mean solderability preservation is only the entry point for consideration. A wide variety of finishes are available to designers and manufacturers. This webinar will review the strengths and weaknesses of available finishes, with consideration given to ease of manufacturing, assembly limitations, cost and fit to key advanced designs. Board/substrate manufacturers, assemblers and electronic package designers will find value in this review.
About the Speaker
John Swanson is Director of Final Finishes for MacDermid Alpha Circuitry Solutions. In his 20-year tenure with MacDermid Alpha, John has servered in a variety of roles linked to both product and business development. Prior to his time at MacDermid Alpha, he worked in chemical process development, serving the electronic connector industry, and began his career as a process engineer in the steel industry. John has a bachelor’s degree in Chemical Engineering and an MBA from the University of Pittsburgh.