Advancing Manufacturing Technology

Event Calendar

Wednesday, July 28, 2021

Packaging Tech Topic Series: Matched Material Solutions for Power Electronics

Start Date: 7/28/2021 9:00 AM EDT
End Date: 7/28/2021 10:00 AM EDT

Location:
United States 

Organization Name: iNEMI

Contact:
Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820


Wednesday, July 28, 2021
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
NOTE: this webinar is open to industry — iNEMI membership is not required.
Register now

Abstract

Wide band gap semiconductors such as silicon carbide (SiC), which offer superior performance, are replacing traditional silicon devices for use in high performance power electronics. With this change, previously state-of-the-art interconnection technologies are no longer suitable for new demanding application requirements. New generation power modules and systems require engineered matched materials that correspond to the application. Heraeus’ innovative materials and matched material solutions reduce complexity, improve reliability and address high temperature requirements. This webinar will highlight evolving trends in power electronics, challenges in new generation power electronics, application-specific requirements and tailored solutions. 


About the Speaker


Aarief Syed-Khaja
Heraeus Deutschland GmbH/Heraeus Electronics


Aarief Syed-Khaja is presently Global Head of Engineering Services at Heraeus Deutschland GmbH/Heraeus Electronics. He is responsible for Engineering Services activities, with a focus on power electronics. He directs new prototype and process development in power electronics with a focus on WBG integration, especially SiC/GaN semiconductors and high-temperature operations. Aarief holds doctoral and master degrees in electronics packaging and has been in this segment since for nine years, working in industrial, research and consulting positions.