Event Calendar

Start Date: 8/30/2017 1:00 PM EDT
End Date: 8/30/2017 2:00 PM EDT

1:00-2:00 p.m. EDT (USA)
7:00-8:00 p.m. CEST (Central Europe)

The webinar is free and open to industry; advance registration is required.

Register here for this session.

Presenter: Bill Bottoms (3MTS), Chair, Packaging & Component Substrates TWG
 
For the last 50 years Moore’s Law scaling has paced electronics industry growth, and packaging innovation will be a major enabler in maintaining the pace of progress. Historically, innovations in packaging were focused on minimizing impact to the power, performance and latency of silicon. Packaging has come a long way from that supporting role, and is now emerging as a key product differentiator in many cases. Emerging package types such as fan-in and fan-out wafer level packaging (WLP), 2.5D and 3D integration, system in package (SiP) and heterogeneous integration (HI) represent key innovations that need to be accelerated to maintain the pace of progress.
 
This webinar will review key highlights from the Packaging & Component Substrates chapter of the 2017 iNEMI Roadmap. Join us to learn where packaging technology is headed.

Note:  This webinar will be recorded for anyone who is interested but cannot participate in this session.