Advancing Manufacturing Technology

Event Calendar

Wednesday, August 25, 2021

Packaging Tech Topic Series: Advanced Packaging Materials for High-Speed and High-Frequency Applications

Start Date: 8/25/2021 9:00 AM EDT
End Date: 8/25/2021 10:00 AM EDT

Location:
United States 

Organization Name: iNEMI

Contact:
Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

Wednesday, August 25, 2021
NOTE: this meeting is for members only
9:00-10:00 a.m. EDT (Americas)
3;00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar (requires log-in)



Abstract: High-Speed and High-Frequency Applications Enabled by DuPont’s Advanced Packaging Materials 

Artificial Intelligence, autonomous driving, high-performance computing, 5G, IoT, quantum computing and smart connectivity have increased the need for high data transfer rates and greater bandwidth which requires a multigenerational connectivity network over the next few decades. The ubiquitous demand for data and connectivity has created needs for materials with unique properties to deliver high performance in this expanding ecosystem. Designers faced with new demands arising from frequencies 100 Gigahertz and beyond are constrained by miniaturization, shorter development cycle times and need for cost-effective solutions. Critical areas requiring new material innovations include high-speed digital, high-frequency applications, thermal management, shielding needs and power optimization.To meet these challenges, the tradeoffs and benefits of dielectric and flexible polyimide materials must be identified.  

DuPont offers a wide range of solutions for the electronics industry including ceramics dielectrics for MCMs, copper, silver and lead-free solder plating solutions including low-melting alloys as well as a broad portfolio of thermal interface materials and EMI shielding solutions. In this webinar, the presenters will share information about the material solutions for high-speed and high-frequency systems that are widely used in applications including automotive, radar, telecommunications, satellite technology, consumer, medical and a host of others where a high level of reliability, efficiency and performance is critical.



About the Presenters

Kirk Thompson, Ph.D., MBA
Global R&D Director Advanced Packaging Technology
and Site Leader Sunnyvale Technical Center
DuPont Electronics and Industrials


Kirk Thompson is the global R&D director for Advanced Packaging Technology and Silicon Valley Technology Center at DuPont. In this role he has led global teams to deliver technology in key technology areas including 3D integration, flip chip technologies as well as FOWLP.  DuPont has the unique ability to deliver broad technologies including metallization, dielectric, thermal and assembly materials, which allows a “system” approach to technology development. Prior to joining Electronics and Industrials, Kirk held numerous roles in Dow including President and CEO of NuvoSun Inc., a wholly owned subsidiary of The Dow Chemical Company. In these roles Kirk led teams that commercialized new thin film solar technologies, commercialized the DOW POWERHOUSE™ Solar Shingle and other Building Integrated Photovoltaic (BIPV) products.

Kirk holds a Ph.D. in Chemical Engineering from Iowa State University, an executive MBA from Northwood University, as well as a B.A. in Chemistry from St. Olaf College. Kirk received the Professional Progress in Engineering Award from Iowa State University in 2010, along with several other internal awards.  



Michael Gallagher, Ph.D.
R&D Fellow - Advanced Packaging Technologies
DuPont Electronics and Industrials


Michael is R&D Fellow in the Semiconductor Technologies division of DuPont Electronics and Imaging. His primary responsibility is development of new polymeric materials and integration processes for Packaging and 3D-Interconnect Technologies. Prior to his current role, Michael led an R&D team in Advanced Packaging developing photodielectric, bonding and underfill materials and in Semiconductor Technologies developing both lithographic materials and air gap/porous low-k dielectic materials. He joined the company in Spring House, Pennsylvania in 1987 and transferred to Marlborough, Massachusetts in 2001. He has more than 60 granted patents as well as over 40 presentations and papers relating to electronic materials and their integration.

Michael earned a B.S. in Chemistry from Yale University, a Ph.D. in Inorganic Chemistry from MIT, followed by postdoctoral research at the Technische Universität Berlin in Germany and in Ceramics Processing at MIT.