Event Calendar

Start Date: 9/17/2024 10:00 AM JST
End Date: 9/17/2024 11:00 AM JST

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Organization Name: iNEMI

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Abstract
Tin-bismuth (Sn-Bi) alloys are candidates for low-temperature solders as replacements for current lead-free (Pb-free) solders. It has been shown that Sn-Bi alloys differ from most Pb-free solder alloys in that, in many instances, they lack ductility when deformed at high strain rates. It has also been shown that the large changes in the solubility of Bi that occur with variations in temperature and non-equilibrium cooling that typically occurs in industrial processes, result in a dynamic microstructure that can dissolve or precipitate bismuth on thermal cycling. These changes in microstructure can occur in relatively short timeframes due to the high homologous temperature, even at room temperature. This webinar provides an overview of the fundamental properties of Sn-Bi low-temperature solder alloys obtained by researchers at the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), a collaboration between the University of Queensland and Nihon Superior Co. All data shown in the seminar have been published in peer-reviewed journals or presented at international conferences by NS CMEM.
 
 
About the Speaker
Professor Nogita graduated as an engineer in Japan in 1990 and worked in the nuclear power industry with Hitachi Ltd. He was awarded a Ph.D. from Kyushu University in 1997. He migrated to Australia in 1999 after accepting a position at the University of Queensland, where he became the founding director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) in 2012 as well as project manager of the University of Queensland – Kyushu University Oceania project (UQ-KU project) and Deputy Chair of the International Development and Engagement Committee at the School of Mechanical and Mining Engineering. He is also an invited Professor at Kyushu University and a Research Adviser at the University of Malaysia Perlis.
 
Dr. Nogita’s research is in three major areas: Pb-free solders and interconnect materials, energy materials such as hydrogen-storage alloys, and structural and coating alloy development. He holds 19 international patents and has authored over 250 refereed scientific papers with an h-index of 57 (Google Scholar Aug 2024). He is a deputy chair for the Electronic Packaging and Interconnection Materials (EPIM) Committee (since 2022), and leading organizer (2019 and 2023) and co-organizer of the “Emerging interconnect and Pb-free materials for advanced packaging technology” symposium at TMS in the USA (2015 to present). He was the recipient of the TMS Research to Industrial Practice Award in 2021.
 
 
Registration
This webinar is open to industry; advance registration is required (see link below). If you have any questions or need additional information, please contact Mashiro Tsuriya (m.tsuriya@inemi.org).
 
September 17, 2024
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on September 16
Register for this webinar
 
Also see Packaging Interconnect Material Technology Series: Transient Liquid Phase Bonding for High-Temperature Soldering Processes (September 24, 2024)