Advancing Manufacturing Technology

Event Calendar

Wednesday, September 29, 2021

Packaging Tech Topic Series: Advanced Packages with Memory Integration Solutions

Start Date: 9/29/2021 9:00 AM EDT
End Date: 9/29/2021 10:00 AM EDT

Location:
United States 

Organization Name: iNEMI

Contact:
Mashiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

September 29, 2021
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar


Abstract
The application of artificial intelligence requires data to be collected, transmitted, stored and calculated to produce actions that resemble human behaviors.  High-performance computing semiconductors are critical for quickly processing the tremendous amount of data required, and the trend in packaging for these ICs is toward heterogeneous integration to reduce cost and improve performance. Packaging technology has also been focusing on the development of integrated memory solutions to meet chiplet requirements. In this webinar, Dr. Yu-Po Wang, Director, CRD Center, Siliconware Precision Industries Co., Ltd (SPIL), will focus on this trend, including the evolution of product application structure and memory integration packaging solutions. This webinar is open to industry.



About the Speaker
Yu Po Wang, PhD, is Senior Director, CRD Center, for Taiwan-based Siliconware Precision Industries Co., Ltd (SPIL). He has been with SPIL since 1998. Prior to 1998 he worked with Gintic Institute of Manufacturing Technology (Singapore). He has a Ph.D. in Mechanical Engineering from State University of New York at Binghamton, New York, U.S.A.