Start Date: 9/30/2020 9:00 AM HKT
End Date: 9/30/2020 10:00 AM HKT
Wednesday, September 30, 2020
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on September 29
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This webinar will report updated simulation results for Phase 4 of the Warpage Characteristics of Organic Packages project. The end-of-project webinar for this project included a preliminary assessment of the use of modeling/FEA for optimizing package warpage. The team saw inconsistencies in the results of modeling vs. experiments for Cu/mold bi-material strip warpage.
Predicting strip warpage after the molding process is a challenge for the IC packaging industry because simulation tools need to consider multiple processes and complex material properties. The team has conducted further simulations to study the cure shrinkage properties and post mold cure (PMC) process. The results indicate that curing has significant impact on warpage amplitude and the PMC process does not affect warpage trends. The studies also demonstrated that simulation can capture warpage at high temperatures.
This webinar is open to members and non-members; advance registration is required. Register for this webinar