Advancing Manufacturing Technology

Event Calendar

Thursday, August 26, 2021

End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Session 1 (members only)

Start Date: 8/26/2021 9:00 AM EDT
End Date: 8/26/2021 10:00 AM EDT

United States 

Organization Name: iNEMI

Masahiro Tsuriya
Phone: (984) 333-0820

Session 1 (Americas & EMEA)
Thursday, August 26, 2021
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Session 2 (APAC)
Friday, August 27, 2021
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on August 26

Register for Session 1 or 2 
(members only; requires log-in)

The demand for integrated silicon packages is driving packaging advancements for increasingly fine circuit pattern designs. Due to the thinner copper and finer features required for advanced packaging, copper line defects can significantly impact yield and reliability.  Patterning defect inspection limitations are likely to impact yield assessment and quality validation on the substrate/interposers used for heterogeneous SiP packages. Measurement capability becomes more critical for fine lines (<10um) and spaces (<10um) as processes become more complicated and yields are more difficult to control. 

Project Phases 1 & 2
iNEMI began work on this issue in 2016 with the Fine Pitch Circuit Pattern Inspection/Metrology project. Phase 1 of the project conducted an industry-wide survey to assess the readiness of measurement and inspection capabilities and completed a gap analysis. Input from this survey established the basis for Phase 2 activities where a fine-featured test vehicle was designed and fabricated using thin film processing technologies on both glass and silicon substrates to evaluate and assess the limits of today’s AOI (automated optical inspection) metrology equipment. Results confirmed that the industry’s AOI capabilities for packaging features are reaching detection limits.  

Phase 3 Focus
iNEMI has recently completed Phase 3 of the Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project. In this latest phase the project team focused on examining measurement capabilities on fine line (<10um) and space (<10um) copper patterns on an organic material-set panel (see the test vehicle design below). Test vehicles were designed with fine pitch pattern trace widths from 10um nominal down to 1um nominal and incorporated known defective fine-featured wiring to comprehensively examine AOI ability to handle differences in organic material properties such as color, reflectivity, and surface roughness as well as substrate warpage and shape deformation. 

This end-of-project webinar will present Phase 3 results, including a summary of the team’s evaluation of seven different AOI systems from different AOI companies. These results include test vechicle verification, detection capability studies based on two major defect types: nick and protrusions, and a measurement capability study up to 3um traces. Observations and plans for future work will also be shared.

Test vehicle design

Phase 3 Project Leaders
  • Feng Xue, IBM
  • Joe Zou Zhihua, Intel
  • Charles Reynolds, IBM
This webinar is open to iNEMI members only and advance registration is required. Two webinars are scheduled, so, please join whichever one which fits your availability (see links above). For additional information, contact M. Tsuriya (