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Fine Pitch Circuit Pattern Inspection/Metrology Project, Phase 1

This project was organized to assess measurement and inspection capabilities for fine circuit pattern substrates used in high-bandwidth applications. Phase 1 benchmarked the metrology for fine pitch design on panel-sized areas, and the results were discussed in this end-of-project webinar, along with plans for Phase 2 activities. This meeting was open to industry. To download the presentation (which includes a link to the recorded session), please fill out this form.

Fill Out This Form TO DOWNLOAD THE PRESENTATION