HFR-Free Signal Integrity, Phase 2
Chair: Stephen Hall, Intel Corporation
Co-chair: David Senk, Cisco
This Project is part of the HFR-Free Leadership Program
BackgroundThis project will focus on ensuring there is no degradation of electrical signals in HFR-free PCB materials. Plans are to investigate the critical electrical parameters of new HFR-free materials. The team will identify candidate materials, review prior work to define key performance characteristics and test criteria, and design test vehicle(s) and test methodologies, leveraging standards where possible. The project will also assess technology readiness and identify gaps, plus assess manufacturing capability and supply capacity.
Statement of Work
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