HFR-Free High-Reliability PCB

End-of-Project Webinar

• Presentation (October 4, 2012)
  (This presentation is for iNEMI members only.)

Statement of Work

• Statement of Work (Version 7.0, August 4, 2008)

Project Objectives

• Build on industry knowledge and capability and Phase 2 (Test) of the iNEMI BFR-Free PCB Project (formerly Halogen-Free)
• Consider unique market segment requirements
• Identify technology readiness and gaps
• Stimulate supply capability
• Determine BFR-free board-level reliability for various components

Presentations

• iNEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation), April 2, 2008; IPC Circuits Expo, APEX and the Designers Summit 2008 (Las Vegas, Nevada)
• iNEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation),  updated version, April 15, 2008

Related iNEMI Projects

• HFR-Free PCB Material Evaluation Project 
• HFR-Free Leadership Program   
     —  HFR-Free PCB Materials, Phase 2
     —  HFR-FREE Signal Integrity, Phase 2

For Additional Information