High-Temperature, Pb-Free Die Attach Material Project

End-of-Project Webinar Presentation: High-Temperature, Pb-Free Die Attach Material Project, Phase 1
(March 23, 2017)

This project focused on assessing the processability and reliability of different Pb-free materials available for power semiconductor die-attach applications on leadframe or ceramic substrates that currently use Pb-containing materials. Phase 1 benchmarked technology, material availability and processing trends. This webinar discusses results from that benchmarking study, along with other findings.