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iNEMI Meeting Presentations at ICEP-IAAC

iNEMI Experimental Investigation on Creep Corrosion, presented by Haley Fu (iNEMI) at ICEP-IAAC 2012 (Tokyo, Japan; April 19, 2012)

Challenges to Increasing Wiring Density for Organic Packaging Substrates, presented by Masahiro Tsuriya (iNEMI) at ICEP-IAAC 2012 (Tokyo, Japan; April 20, 2012)

Upcoming Events

12

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity

10:30 AM to 11:30 AM EDT
17

Sep

iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders

10:00 AM to 11:00 AM JST
17

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives

11:00 AM to 12:00 PM EDT
19

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education

11:00 AM to 12:00 PM EDT
24

Sep

Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering

10:00 AM to 11:00 AM JST

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