ICEP 2022 Presentations
May 11-14, 2022
Hokkaido, Japan
Session WA1: iNEMI Session
May 11, 2022
- WA1-1: “Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer Level Packaging,” presented by Feng Xue, IBM
Project: Panel Level Package Fine Pitch Substrate Inspection/Metrology, Phase 4
- ++ WA1-2: “Novel Method for Measuring High Temperature Hygroscopic Swelling,” presented by Ian Chin, Intel
Project: Moisture Induced Expansion Metrology for Packaging Polymetric Materials, Phase 1
- ++ WA1-3: “Voids in First-Level Interconnects and Their Impact to Solder Joint Reliability,” presented by Kor Oon Lee, Intel
Project: 1st Level Interconnect Void Characterization
- WA1-4: “Low Temperature Interconnects in 1st Level Packaging and its Challenges,” presented by Charles Arvin, IBM
Project: Low Temperature Materials for 1st Level Interconnect Task Force
Session TD2 Emerging Technology 3
Thursday, May 12
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TD2-3: “Comparing Various Test Environments for Conformal Coating Evaluation,” presented by Prabjit Singh (IBM) paper presentation
Project: Conformal Coating Evaluation for Improved Environmental Protection, Phase 2