Presentations - iNEMI Session at IMPACT 2017 (members only)

iNEMI Session at 2017 IMPACT (International Microsystems, Packaging, Assembly and Circuits Technology Conference)
Taipei Nangang Exhibition Center

iNEMI Session 
October 27, 2017

Introduction and Agenda, Haley Fu (iNEMI)

Study of SiP Module Moldability, Chih Chung Hsu (CoreTech Systems)

iNEMI Ultra Low Loss Laminate/PCB for High Reliability & Performance, John Lin (Lenovo)

BiSn-Based Low Temperature Soldering Process and Reliability, Haley Fu (iNEMI)