In Progress

Project Portfolio (October 2023)


Keep Up with the Latest Project Information

We have a lot going on! iNEMI is an industry-led consortium of manufacturers, suppliers, industry associations and consortia, government agencies, research institutes, and universities, and through the combined power of this global membership, we help drive technology development and deployment across the global supply chain. One of the ways we do that is through our project work — how projects are formed.

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5G/mmWave

• Also see Roadmap: 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO)

Board Assembly

• AI Enhancement to AOI for PCBA Project, Phase 2
• Bi-Sn Based Low-Temperature Soldering Process and Reliability
• Characterization of Third Generation High-Reliability Pb-Free Alloys
• Conformal Coating Evaluation for Improved Protection against Corrosive Environments, Phase 3
• Electromigration of SiBn Solder for Second-Level Interconnect
• High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2
• QFN Package Board Level Reliability

Optoelectronics

• Best Practices for Expanded Beam Connectors in Data Centers  
• Board-Level Optical Interconnect Performance in Immersion-Cooled Environments
• Comparison of Expanded Beam and Physical Contact Connectors in Data Center Applications, Phase 2

  

Packaging

• Impact of Low CTE Mold Compound on Second-Level Board Reliability, Phase 2
• Low Temperature Material Discovery and Characterization for First Level Interconnect
• Moisture Induced Expansion Metrology for Packaging Polymetric Materials Project, Phase 1
• Package Warpage Prediction and Characterization, Phase 6
• PLP Fine Pitch Substrate Inspection/Metrology, Phase 4
• RDL Adhesion Strength Measurement Project
• ​Warpage Characterization and Management Program  
  • High Density Interconnect Socket Warpage Prediction and Characterization 

 

PCB & Laminates

• Reliability & Loss Properties of Copper Foils for 5G Applications
• PCBA Materials for Harsh Environments, Phase 2 
• Hybrid PCBs for Next Generation Applications
• PCB Characterization for CAF and ECM Failure Mitigation
• PCB Connector Footprint Tolerance

Smart Manufacturing

• AI Enhancement to AOI for PCBA, Phase 2
• Smart Manufacturing Tech Topic Series

 

Sustainble Electronics

• Counterfeit Components Tech Topic Series