Accelerate Innovation
Think strategically, collaborate wisely, solve creatively
The International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit R&D consortium of leading electronics manufacturers and suppliers, along with associations, government agencies, and universities. iNEMI roadmaps the future technology requirements of the global electronics manufacturing industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact collaborations among our members. These collaborations support our members' businesses and help drive the industry by accelerating the deployment of new technologies, developing industry infrastructure, stimulating standards development, and disseminating efficient business practices. In short, we effectively and efficiently bring the latest, greatest technologies to you!
Member OrganizationsOur members encompass the full electronics ecosystem — OEMs, EMS/ODM/OSATs, component & material suppliers, equipment vendors, software providers, university & research laboratories, government agencies, industry associations.
Active ProjectsOur projects address industry knowledge gaps, focusing on common problems best addressed through industry collaboration and in direct alignment with members’ commercial interests. |
CountriesLike the industry, our members are global, with headquarters in 21 countries and locations worldwide.
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Our Members
Upcoming Events
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12Sep
Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity
10:30 AM to 11:30 AM EDT
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17Sep
iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders
10:00 AM to 11:00 AM JST
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17Sep
Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives
11:00 AM to 12:00 PM EDT
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19Sep
Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education
11:00 AM to 12:00 PM EDT
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24Sep
Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering
10:00 AM to 11:00 AM JST
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26Sep
iNEMI/IPC CIS Tech Topic Series: Complex Integrated Systems—The Future of Electronics Manufacturing
11:00 AM to 12:00 PM EDT
Latest News
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ASME’s Journal of Electronic Packaging Features Article from iNEMI Project
An article by INEMI's Moisture Induced Expansion Metrology for Packaging Polymetric Materials Project discusses a new metrology for moisture-induced CTE that extends capabilities beyond current temperature limits.
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In Memorium: Jim McElroy, iNEMI CEO (1996-2009)
It is with great sadness that we share the news that Jim McElroy, former Executive Director and CEO of iNEMI, has passed away.
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iNEMI and IPC Collaborate on Circularity Challenges in Electronics Manufacturing
iNEMI and IPC are collaborating to identify and address some of the key challenges of circularity in electronics manufacturing.
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NEWS RELEASE: iNEMI Announces Member Recognition Awards for 2024
iNEMI announces the recipients of this year's Project Leadership, Dedicated Service and Fellow awards.
Projects
iNEMI's collaborative projects eliminate technology gaps, set direction for future technology, and drive standardization to reduce cost & complexity.