iNEMI will be hosting the Next Generation Solder Materials Workshop at APEX 2019. This workshop is an APEX Buzz Session and is open to industry and free of charge.
New and emerging product markets are driving further miniaturization of components, making smaller and thinner packages and boards the norm. These applications also present unique use and environmental conditions. As a result, the electronics manufacturing industry faces assembly yield and product reliability challenges. How can we successfully mitigate these challenges? Do we modify existing materials and processes or develop new technology?
Join us for this free iNEMI workshop that will focus on the future of solder materials and how these materials must advance to meet the needs of new products and processes. The workshop will be interactive, with speakers, panel sessions and working groups focused on user needs and materials development. The keynote will be delivered by Intel, plus we have additional speakers and panelists from Senju, Alpha Assembly, Henkel, Indium, HP, Dell, Raytheon and John Deere.
Please register so we know you're coming!