iNEMI and SMTA are co-hosting two Pb-free solder webinars: low temperature and high-performance Pb-free solder alloys
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Join iNEMI and SMTA for two webinars addressing Pb-free solder developments
Thermal Fatigue Reliability of High-Performance Pb-Free Solder Alloys Tuesday, May 5
Low Temperature Solder: Enabling the Future Tuesday, May 19
Thermal Fatigue Reliability of High-Performance Pb-Free Solder Alloys Tuesday, May 5 / 11:00 a.m. EDT (Americas) Presented by: Richard Coyle, Ph.D., Nokia Bell Labs
Innovations in Pb-free solder alloy development are being driven by evolving application requirements. There is a growing need for Pb-free solder alloys that can resist thermal fatigue damage in increasingly aggressive product use environments, while providing acceptable performance under drop, shock and vibration loading conditions.
Pb-free solder alloys based on the SnAgCu system (SAC) typically have better fatigue life than traditional eutectic SnPb solder, but their thermal fatigue reliability is limited at higher operating temperatures. New alloys being developed In response to the need for higher temperature performance, are based on the SAC system, but have significant solute additions to promote solid solution, dispersion, or additional precipitate strengthening at higher operating temperatures. This presentation addresses requirements, alloy evolution, and alloy metallurgy, along with the initial results from an iNEMI collaborative project that is evaluating thermal fatigue reliability of multiple high reliability solder alloys. For additional information and to register for this webinar.
Low Temperature Solder: Enabling the Future Tuesday, May 19 / 11:00 a.m. EDT (Americas) Presented by: Kevin Byrd, Intel Corporation
As trends in consumer electronics continue to drive thinner and lighter designs, managing SMT yields and product reliability when using SAC reflow is increasingly challenging. Recent solder paste development activities have been targeted at addressing the historical reliability challenges of Tin-Bismuth based low temperature solder (LTS) materials. These updated materials are showing great promise in meeting product requirements while enabling significant reductions in reflow peak temperature. This webinar will review the status of Sn-Bi solders, requirements for effective conversion from SAC to LTS, and suggest areas that would benefit from additional industry research efforts. For additional information and to register for this webinar.
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