iNEMI Member Meeting (Japan) January 2018

Presentations from iNEMI Member Meeting
Hosted by Dow Chemical
Tokyo, Japan
January 22, 2018

Agenda and Introduction

The Members’ Meeting in Japan was held on January 22, 2018, hosted by Dow Chemical.  Eighteen people attended the meeting (even though it was a snow day). Two members talks were given:
  • Advanced Package Technologies Trend; Rozalia Beica, Dow Chemical
    Presentation included the market drivers and trend and advanced package technology overviews with FI/FO-WLP package evolution.
  • Plate on Film Technology Overview; Hideaki Maeda, Rohm & Haas Electronic Materials K.K.
    Presentation included the metal mesh technology for potential market application and plating technical challenges.
iNEMI project status was presented to the members by Masahiro Tsuriya (iNEMI):
Contact Masahiro Tsuriya for more information.