iNEMI Member Meeting (Japan) Aug 2017

Presentations from iNEMI Member Meeting
Hosted by Takaoka Toko
Tokyo, Japan
August 4, 2017

Agenda and Introduction

The Members’ Meeting in Japan was held on August 4, 2017, hosted by Takaoka Toko.  Eighteen members attended the meeting. Two members talks were made:
 

• Power Overlay (POL) Technology; Tuominen Risto, GE
  Presentation included film based fan-out package technologies to enhance the thermal performances
   
• Expanded Beam Connector Technology Overview; Yuki Nishiguchi, Senko
  Presentation included expanded beam connectors technology overview and project introduction

Other topics were presented to the members by Masahiro Tsuriya (iNEMI):
 

• iNEMI Roadmap Overview - IoT, Medical Electronics, and Packaging
   
• iNEMI Projects Update
   
• Packaging & Component Substrates TIG
   
• Test TIG
   
• Organic PCB TIG

Contact Masahiro Tsuriya for more information.