Jasbir Bath, INEMI
Craig Hamilton, Celestica
Holly Rubin, Alcatel-Lucent
The Lead-Free Rework Optimization Project used the rework processes developed by previous phases to assemble and rework boards and perform reliability testing to validate the rework processes developed. Part 2 of the end-of-project presentation discusses the results of rework for adjacent components, BGA sockets, mini-pots, PDIPs, and DIMMs.
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