Jasbir Bath, INEMI
Craig Hamilton, Celestica
Holly Rubin, Alcatel-Lucent
Part 1 of the end-of-project presentation of the Lead-Free Rework Optimization Project covers solder joint characterization and reliability. The project evaluated and recommended best practices, rework equipment requirements, impact of adjacent component temperatures and procedures for best practice lead-free rework processing. This presentation discusses details of the accelerated thermal cycling (ATC) test results plus solder joint and plated through hole (pth) copper knee thickness characterization.
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