New iNEMI Initiatives

iNEMI teams identify several new areas for collaboration

Successful iNEMI projects are those that effectively address knowledge gaps, solving a common industry problem. These projects bring together representative groups of organizations from across the design/supply chain to provide an industry-wide response.

Several potential collaborative projects have recently been identified. These new initiatives (listed below) are currently in development and are planning call-for-participation webinars shortly. The initiative process, which defines project scope and objectives, is open to both members and non-members – all are welcome to participate. For more information, please contact the project managers listed below.

The following initiatives are in sign-up

5G/mmWave Materials Assessment and Characterization — Characterize ultra-low loss laminate materials using specific Df/Dk measurement methodologies in the range of 30-100GHz and provide guidelines for best practices to the industry. Contact: Urmi Ray (urmi.ray@inemi.org).
Best Practices for Expanded Beam Connectors in Data Centers — Develop industry cleanliness guidelines for the use of expanded beam connectors in this high-performance environment to help enable wider use of the technology and leverage operational expense reductions. Contact: Steve Payne (steve.payne@inemi.org)
High Density Interconnect Socket Warpage Prediction and Characterization — Establish socket warpage measurement metrology and prediction methods for large, high-density socket connectors (>50x50mm), and determine the impact of molding, material properties and design on warpage. Contact: Haley Fu (haley.fu@inemi.org).
Impact of Voiding on Thermal Performance of Bottom Terminated Components (BTCs) — Determine impact of voiding on thermal performance (e.g., void density, location of voids) and develop guidelines/design rules to help reduce the impact of voiding on reliability. The initial focus will be on thermal measurement capabilities, including development of a test vehicle and thermal measurement techniques. Contact: Mark Schaffer (marks@inemi.org).
Non-Physical Data Destruction for Enterprise Storage — Determine the feasibility of non-physical data destruction options that meet data center provider expectations in order to create a higher value stream for end-of-life storage devices that can be reused. Contact: Mark Schaffer (marks@inemi.org).
Smart Manufacturing: Data Management Best Practices for PCB Assembly — Develop a generic reference data architecture and best practices for a typical electronics assembly line to enable efficient implementation of smart PCB assembly in a manufacturing environment where diverse supplier equipment is used. Contact: Kevin McGowan (kmcgowan@inemi.org).
Package Warpage Prediction and Characterization — Characterize dynamic warpage for the latest packaging technologies and establish a reliable modelling framework to optimize package warpage simulation with the objective of enabling seamless board assembly and high yield. Contact: Haley Fu (haley.fu@inemi.org).

New iNEMI Initiatives