New iNEMI Initiatives

iNEMI teams identify several new areas for collaboration

Successful iNEMI projects are those that effectively address knowledge gaps, solving a common industry problem. These projects bring together representative groups of organizations from across the design/supply chain to provide an industry-wide response.

Several new initiatives are currently in development and several more have recently launched. The initiative process, which defines project scope and objectives, is open to both members and non-members – all are welcome to participate. For more information, please contact the project managers listed below.

In development (new initiatives)

5G Test Methodology Challenges — Determine best cost-effective approaches for 5G testing at package/module, board and system levels. Contact: Urmi Ray (urmi.ray@inemi.org)
Electromigration in Low Temperature Solder at Board Level — Determine current density vs resistance increase for a range of solder joint sizes (100 microns to 500 microns) in order to verify whether electromigration would be a potential risk for low temperature soldering for 2nd level interconnect solder joints. Contact: Haley Fu (haley.fu@inemi.org)

Extended Reliability Assessment for Electronic Components — Develop a standardized procedure for extended reliability assessment and component classification from a proof-of-concept data collection plan. Contact: Mark Schaffer (marks@inemi.org)
Impact of Voiding on Thermal Performance of Bottom Terminated Components (BTCs) — Determine impact of voiding on thermal performance (e.g., void density, location of voids) and develop guidelines/design rules to help reduce the impact of voiding on reliability. The initial focus will be on thermal measurement. Contact: Mark Schaffer (marks@inemi.org)
Low Temperature Solders for 1st Level Interconnection — Provide data-based guidance on the characterization and selection of interconnect materials that can deliver an overall reduction on the process temperature required in the first level construction of IC packages. Contact: Masahiro Tsuriya (m.tsuriya@inemi.org)
PCB Fiberglass Cloth Characterization for CAF Failure Mitigation — Characterize the effect of glass cloth on PCB reliability by separating failure mode from effect of low loss resins and copper foil; and investigate the effect of fabrication techniques typical for 5G and high frequency designs. Contact: Steve Payne (steve.payne@inemi.org)
PIC Chip and Micro Optics Demonstrator for Edge Pluggable Free Space Connector — Build and demonstrate a board-level optical interconnect system in which an expanded-beam optical connector interface will be developed for the chip module. Develop manufacturing guidelines for PIC module and micro optics. Contact: Grace O’Malley (gomalley@inemi.org)
RDL Adhesion Strength Measurement — Evaluate adhesion strength measurement methodologies and characterize RDL mechanical performances; and establish potential common requirements for key material properties so that packaging companies and users have identical qualification requirements. Contact: Masahiro Tsuriya (m.tsuriya@inemi.org)
Reliability & Loss Poperties of Copper Foils for 5G Applications — To characterize various copper surface treatments/resin systems to mitigate signal loss while maintaining good adhesion within the PCB structure. Determine best metrology and test methodology to characterize bond strength. Contact: Steve Payne (steve.payne@inemi.org)
Reliability Testing of Hybrid PCBs for RF Applications — Develop a predictive comparative simulation tool to provide guidance for combining different resin systems. Contact: Steve Payne (steve.payne@inemi.org)
Smart AOI Inspection: Demonstrating Capabilities & Identifying Gaps/Opportunities — Evaluate existing AOI+AI solutions, identify gaps, recommend best practices, and suggest areas for future development. Contact: Haley Fu (haley.fu@inemi.org)

New projects

The following are new projects that are still accepting participants.

5G/mmWave Materials Assessment and Characterization — Characterize ultra-low loss laminate materials using specific Df/Dk measurement methodologies in the range of 30-100GHz and provide guidelines for best practices to the industry. Contact: Urmi Ray (urmi.ray@inemi.org).
Best Practices for Expanded Beam Connectors in Data Centers — Develop industry cleanliness guidelines for the use of expanded beam connectors in this high-performance environment to help enable wider use of the technology and leverage operational expense reductions. Contact: Steve Payne (steve.payne@inemi.org)
Connector Reliability Test Recommendations, Phase 3 — Define, develop a standardized reliability test framework for evaluating electrical connectors across types and use conditions. Contact: Mark Schaffer (marks@inemi.org)
High Density Interconnect Socket Warpage Prediction and Characterization — Establish socket warpage measurement metrology and prediction methods for large, high-density socket connectors (>50x50mm), and determine the impact of molding, material properties and design on warpage. Contact: Haley Fu (haley.fu@inemi.org).

Package Warpage Prediction and Characterization — Characterize dynamic warpage for the latest packaging technologies and establish a reliable modelling framework to optimize package warpage simulation with the objective of enabling seamless board assembly and high yield. Contact: Haley Fu (haley.fu@inemi.org).
Smart Manufacturing: Data Management Best Practices for PCB Assembly — Develop a generic reference data architecture and best practices for a typical electronics assembly line to enable efficient implementation of smart PCB assembly in a manufacturing environment where diverse supplier equipment is used. Contact: Grace O'Malley (gomalley@inemi.org).

New iNEMI Initiatives