New iNEMI Initiatives

iNEMI teams identify several new areas for collaboration

Successful iNEMI projects are those that effectively address knowledge gaps, solving a common industry problem. These projects bring together representative groups of organizations from across the design/supply chain to provide an industry-wide response.

Several new initiatives are currently in development and several more have recently launched. The initiative process, which defines project scope and objectives, is open to both members and non-members – all are welcome to participate. For more information, please contact the project managers listed below.

In development (new initiatives)

5G Test Methodology Challenges — Determine best cost-effective approaches for 5G testing at package/module, board and system levels. Contact: Urmi Ray (urmi.ray@inemi.org)
Eco-Design Leadership Best Practices for Sustainable Electronics — Identify best practices for eco-design that have the greatest impact by including a holistic view of the product in society and environment, and mature the industry’s ability to implement/practice eco-design best practices. Contact: Mark Schaffer (marks@inemi.org)
Connector Reliability Test Recommendations, Phase 3 — Define, develop a standardized reliability test framework for evaluating electrical connectors across types and use conditions. Contact: Mark Schaffer (marks@inemi.org)
Extended Reliability Assessment for Electronic Components — Develop a standardized procedure for extended reliability assessment and component classification from a proof-of-concept data collection plan. Contact: Mark Schaffer (marks@inemi.org)
Impact of Voiding on Thermal Performance of Bottom Terminated Components (BTCs) — Determine impact of voiding on thermal performance (e.g., void density, location of voids) and develop guidelines/design rules to help reduce the impact of voiding on reliability. The initial focus will be on thermal measurement. Contact: Mark Schaffer (marks@inemi.org)
Mitigation of 5G Signal Loss Due to PCB Copper Foil Surface Treatments — To characterize various copper surface treatments/resin systems to mitigate signal loss while maintaining good adhesion within the PCB structure. Determine best metrology and test methodology to characterize bond strength. Contact: Steve Payne (steve.payne@inemi.org)
PIC Chip and Micro Optics Demonstrator for Edge Pluggable Free Space Connector — Build and demonstrate a board-level optical interconnect system in which an expanded-beam optical connector interface will be developed for the chip module. Develop manufacturing guidelines for PIC module and micro optics. Contact: Grace O’Malley (gomalley@inemi.org)

New projects

The following are new projects that are still accepting participants.

5G/mmWave Materials Assessment and Characterization — Characterize ultra-low loss laminate materials using specific Df/Dk measurement methodologies in the range of 30-100GHz and provide guidelines for best practices to the industry. Contact: Urmi Ray (urmi.ray@inemi.org).
Best Practices for Expanded Beam Connectors in Data Centers — Develop industry cleanliness guidelines for the use of expanded beam connectors in this high-performance environment to help enable wider use of the technology and leverage operational expense reductions. Contact: Steve Payne (steve.payne@inemi.org)
High Density Interconnect Socket Warpage Prediction and Characterization — Establish socket warpage measurement metrology and prediction methods for large, high-density socket connectors (>50x50mm), and determine the impact of molding, material properties and design on warpage. Contact: Haley Fu (haley.fu@inemi.org).

Non-Physical Data Destruction for Enterprise Storage — Determine the feasibility of non-physical data destruction options that meet data center provider expectations in order to create a higher value stream for end-of-life storage devices that can be reused. Contact: Mark Schaffer (marks@inemi.org).
Package Warpage Prediction and Characterization — Characterize dynamic warpage for the latest packaging technologies and establish a reliable modelling framework to optimize package warpage simulation with the objective of enabling seamless board assembly and high yield. Contact: Haley Fu (haley.fu@inemi.org).
Smart Manufacturing: Data Management Best Practices for PCB Assembly — Develop a generic reference data architecture and best practices for a typical electronics assembly line to enable efficient implementation of smart PCB assembly in a manufacturing environment where diverse supplier equipment is used. Contact: Grace O'Malley (gomalley@inemi.org).

New iNEMI Initiatives