Grace O'Malley, Chief Technical Officer
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Grace joined iNEMI in 2007, as iNEMI was building its presence in Europe. She served as Manager of European Operations and then Managing Director-EMEA. In these roles, she was responsible for interactions with iNEMI members in the region, as well as interfacing with the larger technical community in Europe. She managed all European activities for the consortium, including organizing workshops and forums, engaging participation in and promoting the iNEMI roadmap and collaborative projects.
In 2014, Grace was named Vice President of Global Operation and later became Vice President of Technology and Project Operations, with oversight over iNEMI's project activities She was named CTO in 2024.
Prior to becoming Vice President, Grace was iNEMI's Manager of European Operations and then Managing Director-EMEA. In these roles, she was responsible for interactions with iNEMI members in the region, as well as interfacing with the larger technical community in Europe. She managed all European activities for the consortium, including organizing workshops and forums, engaging participation in and promoting the iNEMI roadmap and collaborative projects.
In 2014, Grace was named Vice President of Global Operation and later became Vice President of Technology and Project Operations, with oversight over iNEMI's project activities She was named CTO in 2024.
Prior to becoming Vice President, Grace was iNEMI's Manager of European Operations and then Managing Director-EMEA. In these roles, she was responsible for interactions with iNEMI members in the region, as well as interfacing with the larger technical community in Europe. She managed all European activities for the consortium, including organizing workshops and forums, engaging participation in and promoting the iNEMI roadmap and collaborative projects.
Grace’s background is in materials and manufacturing research. Prior to joining iNEMI, the majority of her career was spent at Motorola. While there, she worked initially on the development of direct chip attach (DCA)/flip chip capabilities and low-cost assembly processes. In later years she worked as a program manager, interfacing with various business units to help develop and qualify suppliers and to transfer low-cost assembly processes into volume production. She also spent two years establishing and leading a multidisciplinary research team at Motorola’s site in Jaguariuna, Brazil, supporting the volume manufacturing of cell phones, radios and cellular infrastructure for the Latin America markets.
Prior to Motorola, Grace was a research engineer for the National Microelectronics Research Center (now the Tyndall National Institute) in Cork, Ireland. She worked on projects for the European Space Agency, focusing on the assembly of high-reliability packaging for aerospace applications.
Grace has an honors bachelor’s degree in electrical engineering from University College Cork (Ireland), and a master of science in materials and manufacturing engineering from the Illinois Institute of Technology (Chicago, U.S.A.). She has authored presentations for many conferences including IEEE-CPMT, ITAP and ECTC. She holds eight U.S. patents, and is a member of IEEE.