Presentations - iNEMI Substrate and Packaging Technology Workshop (members only)

Toyama, Japan
April 22-23, 2014
These presentations are available to workshop attendees and iNEMI members only, except as noted.  If you are an iNEMI member, please log into or create a web account to view.  If you attended the workshop and need access, please contact
Workshop Program, Abstracts and Speaker Biographies (available to public)
Bill Bader, iNEMI CEO
Rozalia Beica, Yole
Yasumitsu Orii, IBM Japan
Weifeng Liu, Flextronics
Kinya Ichikawa, Intel
John Wen, Huawei
Masateru Koide, Fujitsu
Bill Bottoms, 3MTS
Tim Lenihan, TechSearch
Toshihiko Nishio, STATS ChipPAC
Takashi Kariya, Ibiden
D.C. Hu, Unimicron
Shoji Watanabe, Shinko
Hikari Murai, Hitachi Chemical
Kazuaki Ano, Shinkawa
Haruo Shimamoto, SEMI 3DIC Co-Leader
Outcomes of the Breakout Groups (available to public)
Three Breakout Groups