Conference Papers and Presentations
Pb-Free Electronics Risk Management (PERM) Consortium Meeting No. 13 (July 30 - August 2, 2012, iNEMI Pb-Free Electronics Activity
, presented by Robert Pfahl (iNEMI) (National Electronics Museum; Linthicum Heights, Maryland; July 31, 2012)
Current and Future Needs for Polymeric Materials
, keynote presented by Bob Pfahl (iNEMI) at the Symposium on Polymers for Microelectronics, The Fifteenth Meeting of the Symposium on Polymers for Microelectronics (Wilmington, Delaware; May 8, 2012)
(Joint Conference of "International Conference on Electronics Packaging" and "IMAPS All Asia Conference") (Tokyo, Japan; April 17-20, 2012)
Challenges of Solar Manufacturing
, Alan Rae (TPF Enterprises), Session 24-Solar PV Module Assembly: Challenges & Opportunities, APEX 2010 (April 7; Las Vegas, Nevada)
, presented by Bob Pfahl (iNEMI), to the Sustainable Electronics Forum (October 17, 2012; Wingspead, Wisconsin). The Forum was sponsored by the U.S. Environmental Protection Agency, The Green Electronics Council, and the Johnson Foundation at Wingspread.
iNEMI Pb-Free Electronics Activity
, presented by Robert Pfahl (iNEMI), Pb-Free Electronics Risk Management (PERM) Consortium Meeting No. 13 (National Electronics Museum; Linthicum Heights, Maryland; July 31, 2012)
Data Assessment and Collection for a Simplified LCA Tool, Thomas Okrasinski (Alcatel-Lucent), John Malian (Cisco) and James Arnold (iNEMI), presented by Tom Okrasinski, Carbon Management Technology Conference (February 7-9, 2012; Orlando, Florida) paper presentation
iNEMI Panel Session
(November 9, 2010), Going Green — CARE Innovation 2010 (November 8-11, 2010; Vienna, Austria)
iNEMI HFR-Free Leadership Project Report, Stephen Tisdale (Intel), et al, iMPACT (International Microsystems, Packaging, Assembly & Circuits Technology) Conference (October 21, 2010; Taipei, Taiwan) paper presentation
“The Evolving Direction for Environmental Programs in the Electronics Industry,” Robert C. Pfahl (iNEMI), Systems Packaging Japan Workshop 2010 (January 25, 2010; Kyoto, Japan)
iNEMI HFR-Free Program Introduction, Haley Fu (iNEMI), SMTA South China, August 26, 2009, Schenzen. (This paper received recognition as the Best Paper of Technology Conference Two and was also presented at ICEPT-HDP, August 13, 2009; Beijing, China).
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Addressing Opportunities and Risks of Pb-Free Solder Alloy Alternatives
, Gregory Henshall (Hewlett-Packard); Robert Healey, Ranjit S. Pandher (Cookson Electronics); Keith Sweatman, Keith Howell (Nihon Superior); Richard Coyle, Joe Smetana (Alcatel Lucent); Thilo Sack, Polina Snugovsky (Celestica); Stephen Tisdale, Fay Hua (Intel) and Grace O'Malley (iNEMI); presented by Grace O'Malley, EMPC/European Microelectronics and Packaging Conference (June 16, 2009; Rimini, Italy)
Conversion to Non-Halogenated Flame Retardants in Electronics
, presented by Bob Pfahl and translated by Haley Fu (both iNEMI), part of a high-level business forum sponsored by Reed Exhibitions and co-sponsored by iNEMI, held in conjunction with NEPCON Shanghai/SMTA China East Technical Conference (April 22, 2009; Shanghai)
Failure Mechanisms, Acceptance Criteria, and Accelerated Test Procedures for Electronic Components Used in Active Implantable Medical Devices: Capacitors, iNEMI Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project,
presented by Grady White, NIST, SMTA/MEPTEC 2009 Medical Electronics Symposium, September 16-17, 2009 (Arizona State University, Tempe, Arizona).
iNEMI Study on Board Creep Corrosion
, presented by Haley Fu (iNEMI) at the CEEDI (China Electronics Engineering Design Institute) Technical Seminar on Data Center IT Equipment Corrosion by Gaseous Contamination and Measures (Beijing, China; April 24, 2012).
Technology Trends & Roadmaps for Package Innovation (keynote address), Grace O’Malley (iNEMI), NMI's (National Microelectronics Institute's) IC Packaging Innovation Forum at TWI (May 26, 2011; Cambridge, UK)
iNEMI Solder Paste Deposition Project Report‚ Laye Feng (Huawei Technologies), SMTA China South Technical Conference (August 31, 2010; Shenzhen, China). paper
iNEMI Solder Paste Deposition Project Report, Cherie Chen (IST), et al, iMPACT (International Microsystems, Packaging, Assembly & Circuits Technology) Conference (October 21; Taipei, Taiwan) paper presentation
Contamination Effects on Lens-Based Optics Modules: Modeling and Experimental Analysis
, Christine Chen (Avago Technologies), Yutaka Sadohara (Sumitomo Electric), Tatiana Berdinskikh (Celestica International Inc.), David Fisher (Tyco Electronics), Sun-Yuan Huang (Emcore Corp), Brian J. Roche and Beth Coviello (Cisco Systems Inc.), and Douglas H. Wilson (PVI Systems Inc.), poster session at OFC/NFOEC 2009, March 26 (San Diego, California).
iNEMI Roadmap Issues In Emerging Technologies Panel Discussion (iNEMI members only file), presented by Chuck Richardson (iNEMI) (Orlando, Florida; October 15, 2012)
Highlights from iNEMI's Roadmap Activities, presented by Chuck Richardson (iNEMI) at ITRS Summer Meeting, (July 9, 2012; Monterey, California)
iNEMI Flexible Electronics Roadmap
, Dan Gamota (Printovate), Workshop on Nanofabrication Technologies for Roll-to-Roll Processing (September 27, 2011; Boston Massachusetts)
“Technology Trends & Roadmaps for Package Innovation" (keynote address), Grace O’Malley (iNEMI), NMI's (National Microelectronics Institute's) IC Packaging Innovation Forum at TWI (May 26, 2011; Cambridge, UK)
“iNEMI Roadmap Highlights,” Chuck Richardson (iNEMI), SMTAI 2010 (October 27; Orlando, Florida)
“iNEMI Flexible Electronics Roadmap – From Concept to Product,” Daniel Gamota (Printovate), National Academies Symposium (September 24, 2010; Washington, D.C.)
"iNEMI Roadmap for Solid State Illumination‚" Haley Fu (iNEMI), ICEPT-HDP (August 18, 2010; Xi'an, China) paper presentation
“iNEMI Roadmap Highlights,” Haley Fu (iNEMI), SEIPI General Membership meeting (July 23, 2010; Baguio, Philippines)
Passives — The Road Ahead (highlights from the Passives Chapter of the 2009 iNEMI Roadmap), Grace O’Malley (iNEMI), Workshop on Passive Technology, TC40 meeting, Cambridge, UK, September 9, 2009.
Closing Technology Knowledge Gaps — Projects Arising from the iNEMI Technology Roadmap, Bob Pfahl, Jim Arnold and Grace O'Malley (iNEMI), presented by Grace O'Malley, EMPC/European Microelectronics and Packaging Conference (June 18, 2009; Rimini, Italy)
iNEMI Roadmap Process for Communicating Requirements from OEMs to Suppliers, Grace O’Malley, 10th JIC (JISSO International Council) meeting, May 19, 2009 (held at LETI/Minatec in Grenoble, France).
2009 iNEMI Roadmap (keynote), Grace O’Malley (iNEMI), Astride the Packaging Roadmap Seminar, held at TWI Limited, April 22, 2009 (Cambridge, United Kingdom).
2009 iNEMI Roadmap Keynote and Chapter Discussions, NEPCON Shanghai/SMTA China East Technical Conference (April 21, 2009; Shanghai)
2009 iNEMI Technology Roadmap Forum, APEX 2009 (March 31; Las Vegas, Nevada)
The 2009 iNEMI Roadmap for Solid State Illumination (SSI), presented by Marc Chason (consultant), at the FlexTech Alliance’s 8th Annual Flexible Electronics & Displays Conference (Session 9: Solid State Lighting & Flexible OLEDs), February 4, 2009 (Phoenix, Arizona).