Join | Login | Contact | Search

iNEMI PCB-Laminates Workshop Presentations

This workshop was held in Taiwan on October 22, 2013.

Overview and Agenda

Haley Fu, iNEMI

iNEMI Roadmap and Technical Plan on Organic PCB

Bill Bader, iNEMI

Striking the Balance - Driving Increased Density and Cost Reduction in Printed Circuit Board Designs

Tim Swettlen, Intel

The Signal Integrity Study with Fiber Weave Effect

Peter Liang, Nan Ya CCL

PWB Roadmap for Smartphone

Hirotaka Taniguchi, IBIDEN

Novel DS's Low Loss Materials for High Speed PCB

Jeongdon Kwon, Doosan

Low- and Mid-Loss Materials: Performance and Cost Drivers, 2013-2015

Mason Hu, Cisco

Low Transmission Loss Multilayer PWB Materials for High-Speed and High-Frequency Applications

Kazutoshi Danjobara, Hitachi Chemical

Materials for Next Generation HDI

Chris Katzko, TTM Techniologies Inc.

Upcoming Events

26

Sep

CHIPS R&D Standards Summit

9/26/2023 to 9/27/2023 EDT
26

Sep

Packaging Tech Topic Series: Toward the Physical Reliability of 3D-Integrated Systems

9:00 AM to 10:00 AM EDT
27

Sep

iNEMI Keynote at MMA Conference

8:30 AM to 9:30 AM CET
27

Sep

RESCHEDULED: Seminar on Humidity Robustness and Isolation Coordination for e-Mobility

9:00 AM to 4:30 PM CET
13

Oct

iNEMI Workshop: Reliability and Standards for Automotive Electronics

8:30 AM to 5:30 PM HKT

View All Events