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iNEMI PCB-Laminates Workshop Presentations

This workshop was held in Taiwan on October 22, 2013.

Overview and Agenda

Haley Fu, iNEMI

iNEMI Roadmap and Technical Plan on Organic PCB

Bill Bader, iNEMI

Striking the Balance - Driving Increased Density and Cost Reduction in Printed Circuit Board Designs

Tim Swettlen, Intel

The Signal Integrity Study with Fiber Weave Effect

Peter Liang, Nan Ya CCL

PWB Roadmap for Smartphone

Hirotaka Taniguchi, IBIDEN

Novel DS's Low Loss Materials for High Speed PCB

Jeongdon Kwon, Doosan

Low- and Mid-Loss Materials: Performance and Cost Drivers, 2013-2015

Mason Hu, Cisco

Low Transmission Loss Multilayer PWB Materials for High-Speed and High-Frequency Applications

Kazutoshi Danjobara, Hitachi Chemical

Materials for Next Generation HDI

Chris Katzko, TTM Techniologies Inc.

Upcoming Events

28

Mar

iNEMI Packaging Tech Topic Series: Evolution of Power Packaging

9:00 AM to 10:00 AM EDT
5

Apr

Sustainable Electronics TIG: New Circular Economy Standards (members only)

11:00 AM to 12:00 PM EDT
13

Apr

Call for Participation: Low-Temp Material Characterization for 1st Level Interconnect - Session 2

9:00 AM to 10:00 AM EDT
13

Apr

Call for Participation: Low-Temp Material Characterization for 1st Level Interconnect - Session 1

10:00 AM to 11:00 AM JST
19

Apr

iNEMI Session at ICEP 2023

9:30 AM to 11:15 AM JST

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