PCB/PCBA Material Characterization for Automotive Harsh Environments
![]() Steve Brown, Alpha |
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Project ReportPCB/PCBA Material Characterization for Automotive Harsh Environments (July 2017). This is for iNEMI members only. You must be logged into your iNEMI web account to access the document.
Presentation (September 7, 2017). This webinar discussed the work undertaken by the iNEMI Project: PCB/PCBA Material Characterization for Automotive Harsh Environments. The need for specifications for material used for printed circuit board and printed circuit assembly in harsh automotive environments has long been identified; the existing process today is inconsistent with no coherent view of specifications for automotive electronics for high power, high density and high reliability. Many International Standards are not written specifically for ‘under-the-hood’ applications and are therefore not always sufficient or appropriate. Automotive OEMs have therefore defined their own specifications. The project consequently reviewed all associated specifications and undertook a cross comparison with the objective of providing a complimentary and supplementary sequence of common test methodologies by which material suppliers can demonstrate potential suitability and durability of their material to give high confidence of meeting OEM and other relevant standards. This can provide a cost-effective means of specifying material performance and more easily defining material choices by the OEM and their Tier 1 supplier. The webinar also included a summary of potential future work that may be considered.
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