Presentations from iNEMI PCB/PCBA Seminar

These are presentations from the iNEMI PCB/PCBA Seminar, hosted by Lenovo; Taipei, Taiwan (October 25, 2016)
These presentations are available to workshop attendees and iNEMI members only.  If you are an iNEMI member, please log into your account or create a web account to view.  If you attended the workshop and need these presentations, please contact

Seminar Overview
Haley Fu, iNEMI

iNEMI Overview
Masahiro Tsuriya, iNEMI

iNEMI 2017 Roadmap, Board Assembly Chapter, Structure/Sample Highlights
Haley Fu, iNEMI

Lenovo Data Center Group (DCG)
Joys Lee, Lenovo

Non-contact Open Test Technology VTEP
Derek Yu, Keysight Technologies

Challenges and Opportunities for Next Generation Advanced Packaging and PCB Assembly
WU WeiPing, Jabil

Advances Substrate Materials for Next Generation Package
Laminate Materials R&D Department, Hitachi Chemical Co., Ltd.

Electronic World is Changing - Technology Highlights and R&D Focus
Rainbow Yuan, AT&S