Call-for-Participation Presentation (April 14, 2021)
Statement of Work
Industry roadmaps predict that silicon-photonics-based transceiver modules will provide the most cost-effective and energy-efficient solutions for onboard interconnections in the future. Before the anticipated benefits of silicon photonics can be realized, new high-performance, cost-effective and compact solutions for optical packaging and connection must be developed and demonstrated, and these solutions be compatible with high-volume manufacturing.
iNEMI is presently addressing the development of separable single-mode (SM) optical interface modules — including suitable photonic integrated circuits (PICs), connectors and assembly technologies — for data center applications, which demand higher efficiency and compact optical switches. This work is important to help ensure supply chain readiness.
This project will allow evaluation of existing and developing components, and thereby identify gaps in the board-level technologies needed for practical implementation.
Phase 1 of the project will:
Future phases are planned to:
Related ProjectsPrevious work in the iNEMI-IPSR Board-Level Optical Interconnect projects identified the need for assessment of the performance of prototypes of board-level interconnect systems based on SM fiber, expanded-beam optical coupling, and silicon photonics transceivers.