Advancing Manufacturing Technology

Warpage Characteristics of Organic Packages, Phase 1 (Package Warpage Qualification Criteria)

Chair: Wei Keat
Loh, Intel

Carson, Cisco


 Problem Statement

  • Current standard is not adequate to predict good yield results at 1st and 2nd level assembly
  • Measurement methods (dimensional and test) not common


  • Define the qualification method and criteria; e.g., sample size, precondition, variations of material and processes (1st and 2nd level)
  • Establish measurement methods

Expected Output

  • Procedure and criteria reference for OEM and suppliers

Statement of Work

  • Statement of Work - Package Qualification Criteria to Ensure Acceptable Warpage Performance for 2nd Level Assembly (Version 3.0; September 21, 2010)
  • Note that this project is the first phase of what later became known as the Warpage Characteristics of Organic Packages projects (see links below).

Related Work

For Additional Information

Haley Fu (Asia)
+86 21-2215 7746