HERNDON, Virginia — February 9, 2012 — The International Electronics Manufacturing Initiative (iNEMI) will be well-represented at SMTA’s Pan Pacific Microelectronics Symposium next week (February 14-16 in Kauai, Hawaii). Representatives from iNEMI and its member companies will report on the consortium’s latest roadmap as well as results from some recently completed projects, as outlined below.
2011 iNEMI Technology Roadmap and Its Place in Fulfilling the iNEMI Mission, will be presented by Bill Bader, iNEMI CEO, as part of the Global Summit on Electronics Industry Roadmaps (TP1: Roadmap Plenary Session).
Investigation of Factors That Influence Creep Corrosion, presented by Prabjit Singh, IBM, is the keynote for session WAI: Evaluation and Failure Analysis. This presentation will review some of the findings to date from the iNEMI Creep Corrosion Project team.
Developing the iNEMI Research Plan from the Roadmap, presented by Bill Bader, iNEMI, will be featured in session WP2: Roadmap Application.
PCB Dynamic Co-Planarity at Lead-Free SMT Temperatures, presented by John Davignon, Intel Corporation, is the keynote for session WPI: Failure Modeling and Design. The paper will discuss results from the iNEMI Board Coplanarity in SMT Project.