2009 iNEMI Roadmap Set to Debut at Conferences in North America, Europe and Asia
HERNDON, VIRGINIA (March 10, 2009) -- The International Electronics Manufacturing Initiative (iNEMI) will release its 2009 Roadmap to industry in April and is scheduled to discuss findings at several industry venues around the world.
- IPC APEX EXPOOOO 2009, March 31, Las Vegas, Nevada, USA The iNEMI Roadmap session is one of the APEX free forums (#FF02, 3:15-4:45). It will provide a general overview of roadmap highlights as well as details from the environmental, board assembly and new technology chapters.
- SMTA China East (co-located with NEPCON Shanghai), April 21, Shanghai Everbright Convention and Exhibition Center, Shanghai, China This session (10:15-12:00) will provide an overview of the 2009 iNEMI Roadmap along with discussions from the board assembly, environmental and test chapters.
- "Astride the Packaging Roadmap" seminar, held at TWI Ltd., April 22, Cambridge, UK A keynote address will highlight findings of the 2009 Roadmap, focusing on packaging.
- European Microelectronics & Packaging Conference (EMPC), sponsored by IMAPS Italy and IEEE, and co-sponsored by iNEMI, June 15-18, Rimini, Italy This presentation will provide an overview of the 2009 roadmap plus additional details from the environmental, packaging and new technology chapters.
The iNEMI Roadmap maps the future manufacturing technology needs of the global electronics industry in an effort to identify key technology and infrastructure developments needed to ensure the competitiveness of the supply chain over the next decade. The iNEMI roadmap has become recognized as an important tool for defining the state of the artttt in the electronics industry as well as identifying emerging and disruptive technologies. It also helps set priorities for research and development over the next 10 years, and is not only used by industry but also by government funding agencies and university-based research programs.
The 2009 Roadmap covers five product sectors and 20 technology and business topics.
The International Electronics Manufacturing Initiatives mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure. This industry-led consortium is made up of more than 65 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China and Limerick, Ireland. For additional information about iNEMI, visit http://www.inemi.org.
For further information:
Cynthia Williams, INEMI