iNEMI Workshop to Focus on Future of Automotive Electronics

Workshop to be held at EMPC 2013 in Grenoble, France

HERNDON, Va. (July 31, 2013) — The International Electronics Manufacturing Initiative (iNEMI) is holding an automotive electronics workshop on September 9, hosted by, and co-located with EMPC 2013 (European Microelectronics Packaging Conference). What’s Down the Road for Automotive Electronics? is a full-day workshop that will focus on identifying and addressing the future manufacturing challenges and opportunities for the global automotive supply chain.

“Automobiles possess some of the most advanced electronic products on the market today,” said Bill Bader, CEO of iNEMI. “In-car instrumentation, navigation capabilities, safety features and infotainment technologies continue to advance, causing vehicles' electronic systems to become increasingly complex. As a result, the reliability, performance demands, and need to reduce cost for automotive electronics are greater than ever before.”

“This workshop will bring together leaders from throughout the supply chain to look at where the automotive electronics industry is headed and identify technology challenges that could potentially stand in the way,” Bill Bader continued.  “We’ll identify those gaps that are common across the supply chain and would benefit from a collaborative approach to reduce risk for the industry and accelerate new and enabling technology development and adoption for a variety of transport segments.”

The workshop agenda features speakers from the automotive and electronics industries, market research firms, policy initiatives and research institutes:

  • Egil Juliussen, Principal Analyst-Infotainment & ADAS, IHS Automotive
  • Riccardo Groppo, Chair of the Automotive Working Group of EPoSS (European Technology Platform on Smart Systems Integration), and CEO of Ideas & Motion 

  • Galen Reeder, Operations Director for Delphi Electronics and Safety, North & South America
  • Bill Bottoms, Chairman, 3MTS, and Chair of the ITRS Assembly & Packaging Technical Working Group and the iNEMI Packaging & Component Substrates Technology Working Group
  • Bart VandeVelde, Team Leader, Package-Level Reliability, imec


Registration for the workshop is 190€. Members of iNEMI and iMAPS can register for a discounted rate of 140€, and also receive a discount on conference registration.  

About iNEMI

The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. This industry-led international consortium is made up of more than 100 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for longer-term industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan. For additional information about iNEMI, go to


For further information:
Cynthia Williams
+1 207-871-1260