Chair: Greg Henshall (Hewlett-Packard)
Co-chair: Stephen Tisdale (Intel Corporation)
This group’s objective is to provide guidance that will help the electronics industry better manage Pb-free alloy proliferation.
Many BGA suppliers are changing the alloys used for Pb-free solder balls to improve mechanical shock performance. As a result, the variety of Pb-free alloys for solder ball terminations is increasing. Several of these alloys have lower levels of silver (Ag) and, therefore, a higher melting point (up to 10(C higher), which may require a change in printed circuit assembly (PCA) manufacturing processes. Suppliers are also promoting a variety of wave solder alloys to address concerns about copper dissolution, barrel fill, common wave defects, and the high cost of alloys. However, the impact of these alloys on the entire PCA system of materials and on long-term reliability is not well understood. As with the solder ball alloys, there are concerns about higher melting temperature, as well as mixing of wave solder with SMT and rework alloys, solder joint reliability, change in alloy composition with time in the pot, and a lack of methodology and test requirements for alloy assessment.
Scope of Work:
Phase I will focus on understanding what knowledge is available for the various alloys being deployed and the related gaps in data. The group will work with the supply base to help manage the variability as well as to encourage the closure of knowledge gaps.