Board Flexure Standardization Project, Phase 1

Chair: Rosa Reinosa (Hewlett-Packard)
Co-chair: Alan McAllister (Intel Corporation)

End-of-Project Webinar

  • Presentation (January 20, 2010)
  • This webinar was for iNEMI members only.

Project Objective

To enhance current IPC/JEDEC standards to promote the use of the spherical bend test method and the use of a common type of strain (diagonal vs. principal) for reliability risk assessment.


The motivation for this new initiative is the need to update current board flexure standards to encompass changes relating to lead-free electronics and to encourage industry adoption of the spherical bend test method as well as consistent strain measurement techniques that are more reflective of ICT testing and assembly. These changes will minimize and help manage risk during manufacturing and assembly, and will allow consistent determination of risk exposure, while providing standardized metrics and methods to be followed. The team's work will target IPC/JEDEC-9702 (Monotonic Bend Characterization of Board-Level Interconnects) and IPC/JEDEC-9704 (Printed Wiring Board Strain Gage Test Guideline).

Damage can be induced in printed circuit assemblies (PCAs) by board flexing during manufacturing and box assembly.  Currently accepted bend test methods do not reflect the actual bending that PCAs undergo in the manufacturing and assembly processes.  The transition to Pb-free manufacturing has exacerbated this deficiency and made it evident that a new bend test method is needed to properly evaluate the risk levels derived from board flexure and assess the potential for damage.

To evaluate risk, the bend-induced stress needs to be measured. Today, companies use different metrics to measure stress, which makes it difficult for suppliers.  The project team will recommend a standardized metric and submit it to IPC/JEDEC as an update to existing standards.

Statement of Work, Version 3.0 (5/8/08)

Project Statement, Version 2.0 (5/8/08) (Sign up ends on Friday, July 11, 2008)


APEX 2008 (April 1, 2008; Las Vegas, Nevada)
   Board & Systems Manufacturing Test TIG Overview
   Board Flexure Standardization Project
   Additional presentations

For additional information