PVC Alternatives

Scott O'Connell, Dell

Background

Seven of the top 10 global PC manufacturers — who represent more than 50% of the worldwide market share for PCs — have set goals to phase out PVC where viable alternatives are identified. This project helped identify those alternatives by conducting a cradle-to-grave lifecycle assessment (LCA) of PVC and PVC-free alternatives, with emphasis on power cord applications and connectors.

Papers & Reports

iNEMI End of Project Presentation: PVC Alternatives, presented by Scott O'Connell (10/04/11) (for iNEMI members only)
iNEMI Final Report: PVC Alternatives Project (9/12/11) (for iNEMI members only)
iNEMI Final Report: PVC Alternatives Project (9/12/11) (for non-members)
iNEMI Interim Project Report: PVC Alternatives Project (11/30/10) (for iNEMI members only)
Environmental Leadership Steering Committee white paper: PVC Alternative Projects

Statement of Work

Statement of Work (Version 3.0, October 12, 2009)

For Additional Information

infohelp@inemi.org

Upcoming Events

12

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity

10:30 AM to 11:30 AM EDT
17

Sep

iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders

10:00 AM to 11:00 AM JST
17

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives

11:00 AM to 12:00 PM EDT
19

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education

11:00 AM to 12:00 PM EDT
24

Sep

Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering

10:00 AM to 11:00 AM JST

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Our Members

PVC Alternatives

Background

Papers & Reports

Statement of Work

For Additional Information

Upcoming Events

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity

iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education

Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering